Kassegne MEMS Research Group
Department of Mechanical Engineering 

College of Engineering
San Diego State
University
San Diego, CA 92182

 

 

 

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ME/EE 685 Homework #3 – Due 3/10/08
By Tricia Nguye

1                             Objective

1.1                           To design an RF MEMS switch in CoventorWare using the PolyMUMPS process and the dimensions of Design B and Design C.  To add wire traces and a bump pad to Design B & C. To deliver masks containing the necessary cells and a top cell for Design B & C show cell hieracrchy as well as the 3D structure of 1cm x 1cm.

2                             Design Requirements

Design C

 

Design B

 

Figure 1 – Design B & C Dimensions

 

2.1                          Wire traces are 7 um thickness and bump pads of 50 um x 50 um at the Poly0 layer.

2.2                          Provide enough length of the traces and pads to enable a spacious and convenient access for probing.

2.3                          The sub-dies should be preferably 1 mm x 1mm.

2.4                          Array these sub-dies to a complete die of 1 cm x 1cm. 

3                             Methods (in CoventorWareฎ)

3.1                          Create a cell called Basic_Anchor to be used for both Design B and Design C. It is a 4um x 4um square applied to Anchor1, Poly1Poly2Via, and Poly0 layers.

3.2                          Create a cell called Basic_Hole to be used for both designs. The mask provides the 10um diameter Etch Holes applied to Hole2, Poly2, Metal, and HoleM layers.

3.3                          Create a cell called Meanders that contain the meanders at the ends of the switch. The meanders are 4um thickness with 4um spacing. Apply this to only the Poly2 layer.

3.4                          Create a 1cmx1cm cell that contains the 1cm x 1cm square sub-die footprint applied to only the GND layer.

3.5                          Create a cell called Traces that contain the dimensions required for the trace and bump pad. Add this to Poly0 layer only.

3.6                          For Design B, create DesignB_RFSwitch that contains the dimensions of the switch. This layout will apply to the Poly2 layer and has the dimensions as shown in Figure 1. This footprint will not contain the meanders at the ends. They will be added on later with the Array Reference function.

3.7                          Using the Array Reference function, add the Basic_Anchor, Basic_Hole, and Meanders cells to the appropriate locations in the DesignB_RFSwitch cell.

3.8                          Using the Reference function, add the Traces cell to the DesignB_RFSwitch cell. Now add the 1cmx1cm cell to complete the sub-die that contains the Design B switch.

3.9                          Create another cell called DesignB_Die that contains the 1mm x 1mm square boundary for the whole die and apply to GND layer only. Use the Array Reference function to add the DesignB_RFSwitch sub-dies into the die and be sure to create 10 rows and 10 columns of the sub-dies. This completes the requirements for Design B.

3.10                      To create Design C, create a new cell called DesignC_RFSwitch that will contain the footprint for the switch design per Figure 1. This first piece of the switch will include the side meanders but not the Meanders cell that will be added to the ends at a later time.

3.11                      Use the Array Reference function to add Basic_Anchor, Basic_Hole, and Meanders cells to the appropriate locations on the DesignC_RFSwitch cell.

3.12                      Use the Reference function to add the Traces cell followed by the 1cmx1cm cell to complete the sub-die for the Design C switch.

3.13                      Create another cell called DesignC_Die that contains the 1mm x 1mm square boundary for the whole die and apply it to GND layer only. Add the DesignB-RFSwitch sub-die cells via Array Reference to create 10 rows and 10 columns of sub-dies. This completes the requirements for Design C.

4                             Deliverables

4.1                          The following results are the various cells that were useful for both Design B and Design C.

Figure 2 – Meander cell
This cell is used with Array Reference to add the meanders at the ends of the switch.

Location of 1 Meander cell in Design B

 

Location of 1 Meander cell in Design C

 

Figure 3 – Location of cells

Figure 4 – Basic_Anchor cell
The 4 um x 4 um square that makes up the anchor masks are applied to Poly0, Poly1Poly2Via, and Anchor1 layers.

Figure 5 – Basic_Hole cell
This 10 um diameter circle makes up the etch holes and are applied to the Hole2, Poly2, Metal, and HoleM layers.

Figure 6 – Traces cell
This trace and bump pad layout was created in Poly0 to be added to each design and can be manipulated or changed at anytime.

4.2                          The following deliverables are for Design B requirements.

  

Figure 7 – DesignB_FSwitch contains the meanders, the anchors, and the etch holes.

Figure 8 – Design C with the traces and bump pad

Figure 9 – Die
Contains 10 rows and 10 columns of the DesignB placed in a 1cmx1cm sub-die using the Array Reference function

Z Scale = 5

 

Figure 10 – 3d image of Design B

Z Scale = 5

 

Figure 11 – Another 3d view of Design B

4.3                          The following are the results for Design C.

                             

Figure 12 – Design C cell
Contains the side meanders and applied to the Poly2 layer only
The end meanders were added via Array Reference

Figure 13 – Design C full mask with Anchor, Etch Holes, Traces/Bump Pad added

Figure 14 – Design C in a 1cmx1cm sub-die

Figure 15 – Design C sub-dies arranged in rows and columns of 10 to make 1 die

Z Scale = 5

 

Z Scale = 5

 

Z Scale = 5

 

Figure 16 – Three different views of Design C in the 3d model

5                             Summary

Cell Name

Description of cell

Layers it was applied to

Basic_Anchor

4um x 4um square anchor centered around the origin

Anchor1, Poly1Poly2Via, Poly0

Basic_Hole

10 um diameter circle centered around the origin

Hole2, Poly2, Metal, HoleM

Meanders

End meanders with dimensions given in Figure1

Poly2

Traces

Contains the traces (7um thick) and the bump pad (50um x 50um)

Poly0

1cmx1cm

Contains the 1cm square that acts as the boundary to the sub-die

GND

DesignB_RFSwitch

Design B switch

Poly2

DesignC_RFSwitch

Design C switch

Poly2

DesignB_Die

Design B sub-dies placed in the die using Array Reference

GND

DesignC_Die

Design C sub-dies placed in the die using Array Reference

GND

6                             Conclusion

The key to completing this assignment efficiently is through organization of cells and manipulation of Array Reference. If there are repeatable features in the design, it is best to create a separate cell. If modifications are required down the road, it would be much easier to modify it once in the cell rather then repeat it for every place that feature is needed. Also, creating separate cells is effective for creating several design variations. In this assignment, it was much quicker to create the anchor, hole, trace, and meander cells once and apply it both Design B and Design C.

 

 

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